YANAMURTHY, Venkata Naga Chandana; NATHI, Venu Kumar. A machine learning approach for evaluating drop impact reliability of solder joints in BGA packaging. Applied Computer Science, [S. l.], v. 21, n. 3, p. 59–71, 2025. DOI: 10.35784/acs_7340. Disponível em: https://ph.pollub.pl/index.php/acs/article/view/7340. Acesso em: 5 dec. 2025.