YANAMURTHY VNC, NATHI VK. A machine learning approach for evaluating drop impact reliability of solder joints in BGA packaging. Appl. Comput. Sci. [Internet]. 2025 Sep. 30 [cited 2025 Dec. 5];21(3):59-71. Available from: https://ph.pollub.pl/index.php/acs/article/view/7340