Ahi K., Asadizanjani N., Shahbazmohamadi S., Tehranipoor M, Anwar M.: Terahertz characterization of electronic components and comparison of terahertz imaging with x-ray imaging techniques. Proc. SPIE 9483, 94830K [https://doi.org/10.1117/12.2183128].
DOI: https://doi.org/10.1117/12.2183128
Bernard D., Golubovic D., Krastev E.: 3D board level x-ray inspection via limited angle computer tomography. Proceedings of the SMTA International Conference, Orlando, Florida, 2012.
Celik T., Tjahjadi T.: Contextual and variational contrast enhancement. IEEE Transactions on Image Processing 20(12), 2011, 3431–3441.
DOI: https://doi.org/10.1109/TIP.2011.2157513
Chang K. H.: Development of optical inspection system for surface mount device light emitting diodes. Master thesis, National Sun Yat-sen University, Taiwan, 2012.
Chang W., Su C., Guo D.: Automated optical inspection for the runout tolerance of circular saw blades. Int. J. Adv. Manuf. Technol. 66, 2013, 565–582.
DOI: https://doi.org/10.1007/s00170-012-4350-6
Doyle J. F.: Wave propagation in structures. Springer Verlag, New York Inc. 1997.
DOI: https://doi.org/10.1007/978-1-4612-1832-6
Gao B., Yue G. Z., Qiu Q., Cheng Y., Shimoda H., Fleming L, Zhou O.: Fabrication and electron field emission properties of carbon nanotube films by electrophoretic deposition. Adv. Mater. 13, 2001, 1770–1773.
DOI: https://doi.org/10.1002/1521-4095(200112)13:23<1770::AID-ADMA1770>3.0.CO;2-G
Guzilov I. A., Kuzmich K. V., Maslennikov O. Y., Smirnova E. V., Minakov P. V., Poroykov A. Y., Rakhimov A. T., Seleznev B., Sen V. V.: Multi beam X-ray tube with the field emitter on the base of nanocrystalline graphite for computer tomography. IEEE International Vacuum Electronics Conference IVEC '09, 2009, 289–291.
DOI: https://doi.org/10.1109/IVELEC.2009.5193411
Hanke R., Fuchs T., Salamon M., Zabler S.: X-ray microtomography for materials characterization. Editors: G. Huebschen, I. Altpeter, R. Tschuncky, H.-G. Herrmann: Materials Characterization Using Nondestructive Evaluation (NDE) Methods. Woodhead Publishing 2016, 45–79
DOI: https://doi.org/10.1016/B978-0-08-100040-3.00003-1
Hanke R., Fuchs T., Uhlmann N.: X-ray based methods for non-destructive testing and material characterization, Nuclear Instruments and Methods. Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 591(1), 2008, 14–18.
DOI: https://doi.org/10.1016/j.nima.2008.03.016
Hendricks R.: On-line inspection enables 6 sigma quality. Circuits Assembly 12, 1990, 23–27.
https://www.eae-elektronik.pl/inspekcja-rtg/ (20.04.2021).
Huang R., Sorini A., McNulty J.: Quantitative solder inspection with computed tomography. 2014 IEEE Symposium on Product Compliance Engineering (ISPCE), San Jose, USA, 2014, 82–85, [http://doi.org/10.1109/ISPCE.2014.6842006].
DOI: https://doi.org/10.1109/ISPCE.2014.6842006
Juha M.: Micro-focus x-ray imaging. Editors: J. S. Heyman: Electronics Reliability and Measurement Technology. William Andrew Publishing, 1988, 60–67.
DOI: https://doi.org/10.1016/B978-081551171-7.50010-X
Kruse R. J., Bossi R. H.: X-Ray Tomographic Techniques for Inspection of Electronic Components. Editors: D. O. Thompson, D. E. Chimenti: Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA, 1991 [https://doi.org/10.1007/978-1-4615-3742-7_5].
DOI: https://doi.org/10.1007/978-1-4615-3742-7_5
Laghari M. S., Memon Q. A.: Identification of Faulty BGA Solder Joints in X-Ray Images. International Journal of Future Computer and Communication 4(2), 2015, 122–125.
DOI: https://doi.org/10.7763/IJFCC.2015.V4.369
Liu Z, Yang G, Lee Y. Z., Bordelon D., Lu J., Zhou O.: Carbon nanotube based microfocus field emission x-ray source for microcomputed tomography. Appl. Phys. Lett. 89, 2006, 1–3.
DOI: https://doi.org/10.1063/1.2345829
Madsen J.: Focal spot size measurements for microfocus X-ray sets. NDT Int 22, 1989, 292–296.
DOI: https://doi.org/10.1016/0308-9126(89)91434-X
Maur F.: X-ray inspection for electronic packaging latest developments. Fifth International Conference on Electronic Packaging Technology Proceedings ICEPT2003, Shanghai, China, 2003, 235–239 [http://doi.org/10.1109/EPTC.2003.1298731].
DOI: https://doi.org/10.1109/EPTC.2003.1298731
Neubauer C., Hanke R.: Improving X-ray inspection of printed circuit boards by integration of neural network classifiers. Proc. Int. Electron. Manufact. Technol. Symp. 1993, 14–18.
DOI: https://doi.org/10.1109/IEMT.1993.398228
Neubauer C., Schropfer S., Hanke R.: X-ray inspection of solder joints by planar computer tomography (PCT). Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium, La Jolla, CA, USA, 1, 1994, 60–64 [http://doi.org/10.1109/IEMT.1994.404691].
DOI: https://doi.org/10.1109/IEMT.1994.404691
Neubauer C.: Intelligent X-ray inspection for quality control of solder joints. IEEE Transactions on Components, Packaging, and Manufacturing Technology: C 20(2), 1997, 111–120 [http://doi.org/10.1109/3476.622881].
DOI: https://doi.org/10.1109/3476.622881
Parmee R. J., Collins C. M., Milne W. I.: X-ray generation using carbon nanotubes. Nano Convergence 2(1), 2015 [https://doi.org/10.1186/s40580-014-0034-2].
DOI: https://doi.org/10.1186/s40580-014-0034-2
Qian X., Tucker A., Gidcumb E., Shan J., Yang G., Calderon-Colon X., Sultana S., Lu J., Zhou O., Spronk D., Sprenger F., Zhang F., Kennedy D., Farbizio T., Jing Z.: High resolution stationary digital breast tomosynthesis using distributed carbon nanotube x-ray source array. Med. Phys. 39, 2012, 2090–2099.
DOI: https://doi.org/10.1118/1.3694667
Rooks S., Sack T.: Xray Inspection of Flip Chip Attach Using Digital Tomosynthesis. Circuit World 21(3), 1995, 51–55 [https://doi.org/10.1108/eb044036].
DOI: https://doi.org/10.1108/eb044036
Roth H., Neubrand T., Mayer T.: Improved inspection of miniaturised interconnections by digital X-ray inspection and computed tomography. 12th Electronics Packaging Technology Conference, Singapore 2010, 441–444 [http://doi.org/10.1109/EPTC.2010.5702680].
DOI: https://doi.org/10.1109/EPTC.2010.5702680
Teramoto A., Yamada M., Murakoshi T., Tsuzaka M., Fujita H.: High Speed Oblique CT System for Solder Bump Inspection. IECON 2007 – 33rd Annual Conference of the IEEE Industrial Electronics Society, Taipei, Taiwan, 2007, 2689–2693 [http://doi.org/10.1109/IECON.2007.4460065].
DOI: https://doi.org/10.1109/IECON.2007.4460065
Thrall D. E.: Textbook of Veterinary Diagnostic Radiology. Elsevier Health Sciences, 2017.
Wang S., Calderon X., Peng R., Schreiber E. C., Zhou O., Chang S.: A carbon nanotube field emission multipixel X-ray array source for microradiotherapy application. Appl. Phys. Lett. 98, 2011, 213701–213703.
DOI: https://doi.org/10.1063/1.3595268
Wankerl H., Stern M. L., Altieri-Weimar P., Al-Baddai S., Kurt-Jürgen L., Roider F., Lang E. W.: Fully convolutional networks for void segmentation in X-ray images of solder joints. Journal of Manufacturing Processes 57, 2020, 762–767.
DOI: https://doi.org/10.1016/j.jmapro.2020.07.021
Yunus M., Srihari K., Pitarresi J. M., Primavera A.: Effect of voids on the reliability of BGA/CSP solder joints. Microelectronics Reliability 43(12), 2003, 2077–2086
DOI: https://doi.org/10.1016/S0026-2714(03)00124-0
Zhang S., De Baets J., Van Calster A.: A new approach to flip chip on board technology using SMT compatible processes. Microelectronics International 16(3), 1999, 39–42.
DOI: https://doi.org/10.1108/13565369910293332
