OVERVIEW OF THE USE OF X-RAY EQUIPMENT IN ELECTRONICS QUALITY TESTS

Magdalena Michalska

doi:10.35784/iapgos.2655

PDF

Published: 2021-06-30

DOI: https://doi.org/10.35784/iapgos.2655

Issue Vol. 11 No. 2 (2021)

A STEP TOWARDS THE MAJORITY-BASED CLUSTERING VALIDATION DECISION FUSION METHOD
Taras Panskyi, Volodymyr Mosorov

4-13
FUZZY APPROACH TO DEVICE LOCALIZATION BASED ON WIRELESS NETWORK SIGNAL STRENGTH
Michał Socha, Wojciech Górka, Marcin Michalak

14-21
APPLICATION OF DIGITAL IMAGE PROCESSING METHODS FOR OBTAINING CONTOURS OF OBJECTS ON ULTRASOUND IMAGES OF THE HIP JOINT
Pavlo Ratushnyi, Yosyp Bilynskyi, Stepan Zhyvotivskyi

22-25
OVERVIEW OF THE USE OF X-RAY EQUIPMENT IN ELECTRONICS QUALITY TESTS
Magdalena Michalska

26-29
SIMULATION AND EXPERIMENTAL RESEARCH OF CLAW POLE MACHINE WITH A HYBRID EXCITATION AND LAMINATED ROTOR CORE
Marcin Wardach, Paweł Prajzendanc, Kamil Cierzniewski, Michał Cichowicz, Szymon Pacholski, Mikołaj Wiszniewski, Krzysztof Baradziej, Szymon Osipowicz

30-35
BATTERY SWAPPING STATIONS FOR ELECTRIC VEHICLES
Aleksander Chudy

36-39
OVERVOLTAGE PROTECTION OF PV MICROINSTALLATIONS – REGULATORY REQUIREMENTS AND SIMULATION MODEL
Klara Janiga

40-43
DETERMINATION OF HYDRODYNAMIC PARAMETERS OF THE SEALED PRESSURE EXTRACTOR
Nataliaya Kosulina, Stanislav Kosulin, Kostiantyn Korshunov, Tetyana Nosova, Yana Nosova

44-47
DEVELOPMENT OF A DEVICE FOR MEASURING AND ANALYZING VIBRATIONS
Anzhelika Stakhova, Volodymyr Kvasnikov

48-51
METHOD OF OBTAINING THE SPECTRAL CHARACTERISTICS OF THE SCANNING PROBE MICROSCOPE
Mariia Kataieva, Vladimir Kvasnikov

52-55
BROADBAND SATELLITE DATA NETWORKS IN THE CONTEXT OF AVAILABLE PROTOCOLS AND DIGITAL PLATFORMS
ENGLISH
Jacek Wilk-Jakubowski

56-60

Authors

Magdalena Michalska

mmagamichalska@gmail.com

Lublin University of Technology, Faculty of Electrical Engineering and Computer Science

http://orcid.org/0000-0002-0874-3285 (unauthenticated)

Abstract

Surface-mount technology is now widely used in the production of many components. The development of the miniaturised electronics industry forces the development of increasingly accurate inspection methods. X-ray and computed tomography are methods to accurately assess the quality of a circuit board. The article discusses the basics of image formation of the tested electronics, the development of the design of the devices used and examples of x-ray, computed tomography applications.

Keywords:

defect inspection, electronic components, industrial radioscopic systems, X-ray, computed tomography

References

Ahi K., Asadizanjani N., Shahbazmohamadi S., Tehranipoor M, Anwar M.: Terahertz characterization of electronic components and comparison of terahertz imaging with x-ray imaging techniques. Proc. SPIE 9483, 94830K [https://doi.org/10.1117/12.2183128].

Bernard D., Golubovic D., Krastev E.: 3D board level x-ray inspection via limited angle computer tomography. Proceedings of the SMTA International Conference, Orlando, Florida, 2012.

Celik T., Tjahjadi T.: Contextual and variational contrast enhancement. IEEE Transactions on Image Processing 20(12), 2011, 3431–3441.

Chang K. H.: Development of optical inspection system for surface mount device light emitting diodes. Master thesis, National Sun Yat-sen University, Taiwan, 2012.

Chang W., Su C., Guo D.: Automated optical inspection for the runout tolerance of circular saw blades. Int. J. Adv. Manuf. Technol. 66, 2013, 565–582.

Doyle J. F.: Wave propagation in structures. Springer Verlag, New York Inc. 1997.

Gao B., Yue G. Z., Qiu Q., Cheng Y., Shimoda H., Fleming L, Zhou O.: Fabrication and electron field emission properties of carbon nanotube films by electrophoretic deposition. Adv. Mater. 13, 2001, 1770–1773.

Guzilov I. A., Kuzmich K. V., Maslennikov O. Y., Smirnova E. V., Minakov P. V., Poroykov A. Y., Rakhimov A. T., Seleznev B., Sen V. V.: Multi beam X-ray tube with the field emitter on the base of nanocrystalline graphite for computer tomography. IEEE International Vacuum Electronics Conference IVEC '09, 2009, 289–291.

Hanke R., Fuchs T., Salamon M., Zabler S.: X-ray microtomography for materials characterization. Editors: G. Huebschen, I. Altpeter, R. Tschuncky, H.-G. Herrmann: Materials Characterization Using Nondestructive Evaluation (NDE) Methods. Woodhead Publishing 2016, 45–79

Hanke R., Fuchs T., Uhlmann N.: X-ray based methods for non-destructive testing and material characterization, Nuclear Instruments and Methods. Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 591(1), 2008, 14–18.

Hendricks R.: On-line inspection enables 6 sigma quality. Circuits Assembly 12, 1990, 23–27.

https://www.eae-elektronik.pl/inspekcja-rtg/ (20.04.2021).

Huang R., Sorini A., McNulty J.: Quantitative solder inspection with computed tomography. 2014 IEEE Symposium on Product Compliance Engineering (ISPCE), San Jose, USA, 2014, 82–85, [http://doi.org/10.1109/ISPCE.2014.6842006].

Juha M.: Micro-focus x-ray imaging. Editors: J. S. Heyman: Electronics Reliability and Measurement Technology. William Andrew Publishing, 1988, 60–67.

Kruse R. J., Bossi R. H.: X-Ray Tomographic Techniques for Inspection of Electronic Components. Editors: D. O. Thompson, D. E. Chimenti: Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA, 1991 [https://doi.org/10.1007/978-1-4615-3742-7_5].

Laghari M. S., Memon Q. A.: Identification of Faulty BGA Solder Joints in X-Ray Images. International Journal of Future Computer and Communication 4(2), 2015, 122–125.

Liu Z, Yang G, Lee Y. Z., Bordelon D., Lu J., Zhou O.: Carbon nanotube based microfocus field emission x-ray source for microcomputed tomography. Appl. Phys. Lett. 89, 2006, 1–3.

Madsen J.: Focal spot size measurements for microfocus X-ray sets. NDT Int 22, 1989, 292–296.

Maur F.: X-ray inspection for electronic packaging latest developments. Fifth International Conference on Electronic Packaging Technology Proceedings ICEPT2003, Shanghai, China, 2003, 235–239 [http://doi.org/10.1109/EPTC.2003.1298731].

Neubauer C., Hanke R.: Improving X-ray inspection of printed circuit boards by integration of neural network classifiers. Proc. Int. Electron. Manufact. Technol. Symp. 1993, 14–18.

Neubauer C., Schropfer S., Hanke R.: X-ray inspection of solder joints by planar computer tomography (PCT). Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium, La Jolla, CA, USA, 1, 1994, 60–64 [http://doi.org/10.1109/IEMT.1994.404691].

Neubauer C.: Intelligent X-ray inspection for quality control of solder joints. IEEE Transactions on Components, Packaging, and Manufacturing Technology: C 20(2), 1997, 111–120 [http://doi.org/10.1109/3476.622881].

Parmee R. J., Collins C. M., Milne W. I.: X-ray generation using carbon nanotubes. Nano Convergence 2(1), 2015 [https://doi.org/10.1186/s40580-014-0034-2].

Qian X., Tucker A., Gidcumb E., Shan J., Yang G., Calderon-Colon X., Sultana S., Lu J., Zhou O., Spronk D., Sprenger F., Zhang F., Kennedy D., Farbizio T., Jing Z.: High resolution stationary digital breast tomosynthesis using distributed carbon nanotube x-ray source array. Med. Phys. 39, 2012, 2090–2099.

Rooks S., Sack T.: Xray Inspection of Flip Chip Attach Using Digital Tomosynthesis. Circuit World 21(3), 1995, 51–55 [https://doi.org/10.1108/eb044036].

Roth H., Neubrand T., Mayer T.: Improved inspection of miniaturised interconnections by digital X-ray inspection and computed tomography. 12th Electronics Packaging Technology Conference, Singapore 2010, 441–444 [http://doi.org/10.1109/EPTC.2010.5702680].

Teramoto A., Yamada M., Murakoshi T., Tsuzaka M., Fujita H.: High Speed Oblique CT System for Solder Bump Inspection. IECON 2007 – 33rd Annual Conference of the IEEE Industrial Electronics Society, Taipei, Taiwan, 2007, 2689–2693 [http://doi.org/10.1109/IECON.2007.4460065].

Thrall D. E.: Textbook of Veterinary Diagnostic Radiology. Elsevier Health Sciences, 2017.

Wang S., Calderon X., Peng R., Schreiber E. C., Zhou O., Chang S.: A carbon nanotube field emission multipixel X-ray array source for microradiotherapy application. Appl. Phys. Lett. 98, 2011, 213701–213703.

Wankerl H., Stern M. L., Altieri-Weimar P., Al-Baddai S., Kurt-Jürgen L., Roider F., Lang E. W.: Fully convolutional networks for void segmentation in X-ray images of solder joints. Journal of Manufacturing Processes 57, 2020, 762–767.

Yunus M., Srihari K., Pitarresi J. M., Primavera A.: Effect of voids on the reliability of BGA/CSP solder joints. Microelectronics Reliability 43(12), 2003, 2077–2086

Zhang S., De Baets J., Van Calster A.: A new approach to flip chip on board technology using SMT compatible processes. Microelectronics International 16(3), 1999, 39–42.

OVERVIEW OF THE USE OF X-RAY EQUIPMENT IN ELECTRONICS QUALITY TESTS. (2021). Informatyka, Automatyka, Pomiary W Gospodarce I Ochronie Środowiska, 11(2), 26-29. https://doi.org/10.35784/iapgos.2655

OVERVIEW OF THE USE OF X-RAY EQUIPMENT IN ELECTRONICS QUALITY TESTS

Issue Vol. 11 No. 2 (2021)

Archives

Authors

Abstract

Keywords:

References

License

Article Sidebar

Issue Vol. 11 No. 2 (2021)

Archives

Main Article Content

Authors

Abstract

Keywords:

References

Article Details

License