ANALYSIS AND VERIFICATION OF INTEGRATED CIRCUIT THERMAL PARAMETERS
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Published:
Dec 9, 2014
Issue Vol. 4 No. 4 (2014)
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Abstract
The paper describes thermal model of an ASIC designed and fabricated in CMOS 0.7 mm (5 V) technology. The integrated circuit consists of analogue and digital heat sources and some temperature sensors. It has been designed to carry out some thermal tests. During tests thermal resistances, capacities, time constants and convection coefficients for different packages, positions and cooling methods were extracted. The parameters of thermal model were used in simulation to compare results with real-world measurements.
Keywords:
thermal resistance, thermal capacity, thermal time constant, CMOS
Article Details
Frankiewicz, M., Gołda, A., & Kos, A. (2014). ANALYSIS AND VERIFICATION OF INTEGRATED CIRCUIT THERMAL PARAMETERS. Informatyka, Automatyka, Pomiary W Gospodarce I Ochronie Środowiska, 4(4), 11–15. https://doi.org/10.5604/20830157.1130166